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| 1. general description the TDA8777 consists of three separate 10-bit video digital-to-analog converters (dacs) with complementary outputs. they convert the digital input signals into analog current outputs at a maximum conversion rate of 330 mhz. the dacs are based on current source architecture. a sync pulse can be added to the green signal (sync-on-green) to allow devices driven by the video dac to be synchronized. the TDA8777 has a power-down mode to reduce power consumption during inactive periods. the TDA8777 is fabricated in a cmos process that ensures high functionality with low power dissipation. 2. features n triple 10-bit dac n sampling frequency up to 330 mhz n internal voltage reference (1.21 v) n complementary outputs n direct drive of double terminated 75 w load into standard level n ttl compatible input n sync and blank control inputs n analog output current source n power-down mode n 3.3 v power supply n lqfp48 package 3. applications n pc video cards n high resolution image processing n digital video systems n general purpose high-speed digital-to-analog conversion TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency rev. 03 15 august 2005 preliminary data sheet
TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 2 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency 4. quick reference data 5. ordering information table 1: quick reference data symbol parameter conditions min typ max unit v dda analog supply voltage 3.0 3.3 3.6 v i dda analog supply current - 90 - ma inl integral non-linearity - 2 - +2 lsb dnl differential non-linearity - 1 - +1 lsb f clk clock frequency TDA8777hl/14/c1 - - 140 mhz TDA8777hl/24/c1 - - 240 mhz TDA8777hl/33/c1 - - 330 mhz p tot total power dissipation - 297 - mw i pd current in power-down mode - 20 - ma table 2: ordering information type number package sampling frequency name description version TDA8777hl/14/c1 lqfp48 plastic low pro?le quad ?at package; 48 leads; body 7 7 1.4 mm sot313-2 140 mhz TDA8777hl/24/c1 240 mhz TDA8777hl/33/c1 330 mhz TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 3 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency 6. block diagram fig 1. block diagram mle290 10 10 10 23-14 11 24 12 36 34 33 10 10 10 current/voltage reference dac control module 35 37 comp v ref + i ref i ref v ref + i ref v ref + i ref rset sync insert sync sync 10-bit dac blanking insert 10 10 10 triple multi- plexer 38 v ssa1 25 v ssa2 v dda1 26 psave vref blue digital inputs (bits b9 to b0) 10-1 green digital inputs (bits g9 to g0) 48-39 13 v dda2 29 red digital inputs (bits r9 to r0) TDA8777 outg outg outb outb blank clk 32 31 28 27 10-bit dac 10-bit dac por outr outr v dda3 30 TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 4 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency 7. pinning information 7.1 pinning 7.2 pin description fig 2. pin con?guration TDA8777hl g0 vref g1 comp g2 outr g3 outr g4 outg g5 outg g6 v dda3 g7 v dda2 g8 outb g9 outb blank v ssa2 sync v ssa1 v dda1 r9 b0 r8 b1 r7 b2 r6 b3 r5 b4 r4 b5 r3 b6 r2 b7 r1 b8 r0 b9 clk psave rset 001aad432 1 2 3 4 5 6 7 8 9 10 11 12 36 35 34 33 32 31 30 29 28 27 26 25 13 14 15 16 17 18 19 20 21 22 23 48 47 46 45 44 43 42 41 40 39 38 37 24 table 3: pin description symbol pin description g0 1 green digital input data; bit 0 (lsb) g1 2 green digital input data; bit 1 g2 3 green digital input data; bit 2 g3 4 green digital input data; bit 3 g4 5 green digital input data; bit 4 g5 6 green digital input data; bit 5 g6 7 green digital input data; bit 6 g7 8 green digital input data; bit 7 g8 9 green digital input data; bit 8 g9 10 green digital input data; bit 9 (msb) blank 11 composite blank control input (active low) sync 12 composite sync control input; for green channel only (active low) v dda1 13 analog supply voltage 1 b0 14 blue digital input data; bit 0 (lsb) b1 15 blue digital input data; bit 1 b2 16 blue digital input data; bit 2 TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 5 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency 8. functional description this triple 10-bit video dac is designed to convert digital input signals into analog output currents. all inputs (clock, data, blank and sync) must be tll levels. 8.1 voltage reference the voltage reference input to pin vref should be 1.21 v. for correct operation, a 100 nf capacitor should be connected between pin vref and pin v dda . b3 17 blue digital input data; bit 3 b4 18 blue digital input data; bit 4 b5 19 blue digital input data; bit 5 b6 20 blue digital input data; bit 6 b7 21 blue digital input data; bit 7 b8 22 blue digital input data; bit 8 b9 23 blue digital input data; bit 9 (msb) clk 24 clock input v ssa1 25 analog supply ground 1 v ssa2 26 analog supply ground 2 outb 27 complementary blue current analog output outb 28 blue current analog output v dda2 29 analog supply voltage 2 v dda3 30 analog supply voltage 3 outg 31 complementary green current analog output outg 32 green current analog output outr 33 complementary red current analog output outr 34 red current analog output comp 35 compliance voltage output vref 36 voltage reference input rset 37 full-scale current control resistor pin psa ve 38 power-save control input (active low) r0 39 red digital input data; bit 0 (lsb) r1 40 red digital input data; bit 1 r2 41 red digital input data; bit 2 r3 42 red digital input data; bit 3 r4 43 red digital input data; bit 4 r5 44 red digital input data; bit 5 r6 45 red digital input data; bit 6 r7 46 red digital input data; bit 7 r8 47 red digital input data; bit 8 r9 48 red digital input data; bit 9 (msb) table 3: pin description continued symbol pin description TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 6 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency an external reference resistor must be connected between pin rset and analog ground. this resistor sets the reference current which determines the analog output level, and is speci?ed to be 560 w . this value allows a 1 v (p-p) output (video plus sync) into a 37.5 w load, such as a double-terminated 75 w coaxial cable. 8.2 blanking and sync pulse insertion the video signal (see figure 3 ) is comprised of the following three parts: ? the video information: de?ned by the 10 bits used to drive the dac; nominal signal amplitude = 700 mv (p-p) ? the sync pulse: a horizontal synchronization (hsync) pulse indicates the end of a video line and the start of the next video line; sync nominal amplitude = 300 mv; sync is added to the video signal output via the sync input (active low) ? the blanking period: allows interface-free detection of both sync and video, blanking is allocated either side of the sync pulse; the blank level is equal to the video black level; blanking is added to the video signal output via the blank input (active low). the values of sync and blank are latched on the rising edge of the clock signal. when no sync and no blank are applied, the dac can be used continuously. this is the so-called generic mode. because the signal delay in the dac is 1.5 times the clock period, the sync and blank are also delayed by 1.5 times the clock period. 9. limiting values fig 3. video signal sync pulse and blanking period mle291 sync pulse blanking period video information 0.7 v 0.3 v table 4: limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v dda analog supply voltage referred to v ssa1 - 0.5 +6.5 v v n voltage on digital input pins referred to v ssa2 - 0.5 +5.5 v t stg storage temperature - 55 +150 c t amb ambient temperature 0 70 c t j junction temperature - 40 +125 c TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 7 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency 10. thermal characteristics 11. characteristics table 5: thermal characteristics symbol parameter conditions typ unit r th(j-a) thermal resistance from junction to ambient in free air for sot313-2 88 k/w table 6: characteristics typical values measured at v dda = 3.3 v; r rset = 560 w ; t amb =25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit supplies v dda analog supply voltage 3.0 3.3 3.6 v i dda analog supply current - 90 - ma p tot total power dissipation - 297 - mw i pd current in power-down mode - 20 - ma inputs v il low-level input voltage - - 0.8 v v ih high-level input voltage 2.0 - - v i il low-level input current - - 80 m a i ih high-level input current - - 120 m a c in input capacitance - TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 8 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency thd total harmonic distortion f clk = 240 mhz f out = 1 mhz - 60 - db f out = 2.2 mhz - 60 - db f out = 4.7 mhz - 60 - db f out = 12 mhz - 60 - db f out = 22 mhz - 54 - db f out = 39 mhz - 51 - db f clk = 330 mhz f out = 1 mhz - 60 - db f out = 2.2 mhz - 60 - db f out = 4.7 mhz - 60 - db f out = 12 mhz - 60 - db f out = 22 mhz - 52 - db f out = 39 mhz - 43 - db sfdr spurious-free dynamic range to nyquist limit f clk = 140 mhz f out = 1 mhz - 62 - db f out = 2.2 mhz - 62 - db f out = 4.7 mhz - 63 - db f out = 12 mhz - 63 - db f out = 22 mhz - 61 - db f out = 39 mhz - 61 - db f clk = 240 mhz f out = 1 mhz - 61 - db f out = 2.2 mhz - 61 - db f out = 4.7 mhz - 63 - db f out = 12 mhz - 56 - db f out = 22 mhz - 58 - db f out = 39 mhz - 52 - db f clk = 330 mhz f out = 1 mhz - 59 - db f out = 2.2 mhz - 59 - db f out = 4.7 mhz - 54 - db f out = 12 mhz - 53 - db f out = 22 mhz - 54 - db f out = 39 mhz - 47 - db outputs v o(compl) output voltage compliance 0 - 1.4 v z out output impedance - TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 9 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency timing f clk clock frequency TDA8777hl/14/c1 - - 140 mhz TDA8777hl/24/c1 - - 240 mhz TDA8777hl/33/c1 - - 330 mhz t d(p) pipeline delay in clock cycles 2.5 2.5 2.5 t su(i) input setup time see figure 4 0.15 - - ns t h(i) input hold time see figure 4 0--ns t d(o) output delay time see figure 4 - 3.75 - ns table 6: characteristics continued typical values measured at v dda = 3.3 v; r rset = 560 w ; t amb =25 c; unless otherwise speci?ed. symbol parameter conditions min typ max unit output delay (t d(o) ) is measured from the 50 % point of the rising edge of clk to the 50 % point of full-scale transition. fig 4. timing diagram digital inputs and analog outputs 001aaa892 clk analog outputs (outb, outb, outg, outg outr, outr) t d(o) digital inputs (r9 to r0, g9 to g0, b9 to b0, sync, blank) t h(i) t su(i) data TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 10 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency 12. application information sampling frequency = 140 mhz. sampling frequency = 240 mhz. fig 5. thd as a function of f out , typical values fig 6. thd as a function of f out , typical values sampling frequency = 330 mhz. sampling frequency = 140 mhz. fig 7. thd as a function of f out , typical values fig 8. sfdr as a function of f out , typical values 001aad345 f out (mhz) 110 2 10 - 40 - 60 - 20 0 thd (db) - 80 001aad347 f out (mhz) 110 2 10 - 40 - 60 - 20 0 thd (db) - 80 001aad348 f out (mhz) 110 2 10 - 40 - 60 - 20 0 thd (db) - 80 001aad427 f out (mhz) 110 2 10 - 40 - 60 - 20 0 sfdr (db) - 80 TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 11 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency sampling frequency = 240 mhz sampling frequency = 330 mhz. fig 9. sfdr as a function of f out , typical values. fig 10. sfdr as a function of f out , typical values fig 11. application diagram 001aad428 f out (mhz) 110 2 10 - 40 - 60 - 20 0 sfdr (db) - 80 001aad429 f out (mhz) 110 2 10 - 40 - 60 - 20 0 sfdr (db) - 80 001aaa890 560 w 0.1 m f TDA8777 36 vref 35 comp 34 outr 33 outr 32 outg 31 outg 37 38 psave rset 39 r0 40 r1 41 r2 42 r3 43 r4 44 r5 45 r6 46 r7 47 r8 48 r9 30 v dda3 29 v dda2 28 outb 27 outb 26 v ssa2 25 v ssa1 v dda 24 23 b9 clk 22 b8 21 b7 20 b6 19 b5 18 b4 17 b3 16 b2 15 b1 14 b0 13 v dda1 1 g0 2 g1 3 g2 4 g3 5 g4 6 g5 7 g6 8 g7 9 g8 10 g9 11 blank 12 sync v dda TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 12 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency 13. package outline fig 12. package outline sot313-2 (lqfp48) unit a max. a 1 a 2 a 3 b p ce (1) eh e ll p z y w v q references outline version european projection issue date iec jedec jeita mm 1.6 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 7.1 6.9 0.5 9.15 8.85 0.95 0.55 7 0 o o 0.12 0.1 0.2 1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 sot313-2 ms-026 136e05 00-01-19 03-02-25 d (1) (1) (1) 7.1 6.9 h d 9.15 8.85 e z 0.95 0.55 d b p e e b 12 d h b p e h v m b d z d a z e e v m a 1 48 37 36 25 24 13 q a 1 a l p detail x l (a ) 3 a 2 x y c w m w m 0 2.5 5 mm scale pin 1 index lqfp48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm sot313-2 TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 13 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency 14. soldering 14.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for ?ne pitch smds. in these situations re?ow soldering is recommended. 14.2 re?ow soldering re?ow soldering requires solder paste (a suspension of ?ne solder particles, ?ux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. several methods exist for re?owing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. typical re?ow peak temperatures range from 215 cto270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: ? below 225 c (snpb process) or below 245 c (pb-free process) C for all bga, htsson..t and ssop..t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. ? below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was speci?cally developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 14 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be ?xed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated ?ux will eliminate the need for removal of corrosive residues in most applications. 14.4 manual soldering fix the component by ?rst soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the ?at part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 c and 320 c. 14.5 package related soldering information [1] for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales of?ce. [2] all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . [3] these transparent plastic packages are extremely sensitive to re?ow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared re?ow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the re?ow oven. the package body peak temperature must be kept as low as possible. table 7: suitability of surface mount ic packages for wave and re?ow soldering methods package [1] soldering method wave re?ow [2] bga, htsson..t [3] , lbga, lfbga, sqfp, ssop..t [3] , tfbga, vfbga, xson not suitable suitable dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable [4] suitable plcc [5] , so, soj suitable suitable lqfp, qfp, tqfp not recommended [5] [6] suitable ssop, tssop, vso, vssop not recommended [7] suitable cwqccn..l [8] , pmfp [9] , wqccn..l [8] not suitable not suitable TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 15 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency [4] these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. [6] wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is de?nitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on ?ex foil. however, the image sensor package can be mounted by the client on a ?ex foil by using a hot bar soldering process. the appropriate soldering pro?le can be provided on request. [9] hot bar soldering or manual soldering is suitable for pmfp packages. TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 16 of 18 philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency 15. revision history table 8: revision history document id release date data sheet status change notice doc. number supersedes TDA8777_3 20050815 preliminary data sheet - - TDA8777_2 modi?cations: ? the format of this data sheet has been redesigned to comply with the new presentation and information standard of philips semiconductors. ? status changed to preliminary data sheet. ? characteristics table revised, spdr and thd data added, see t ab le 6 . ? figure 4 corrected. ? figure 5 through to figure 10 added. TDA8777_2 20040517 objective speci?cation - - TDA8777_1 TDA8777_1 20040108 objective speci?cation - - - philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency TDA8777_3 ? koninklijke philips electronics n.v. 2005. all rights reserved. preliminary data sheet rev. 03 15 august 2005 17 of 18 16. data sheet status [1] please consult the most recently issued data sheet before initiating or completing a design. [2] the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the l atest information is available on the internet at url http://www.semiconductors.philips.com. [3] for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 17. de?nitions short-form speci?cation the data in a short-form speci?cation is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values de?nition limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. 18. disclaimers life support these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change noti?cation (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise speci?ed. 19. trademarks notice all referenced brands, product names, service names and trademarks are the property of their respective owners. 20. contact information for additional information, please visit: http://www.semiconductors.philips.com for sales of?ce addresses, send an email to: sales.addresses@www.semiconductors.philips.com level data sheet status [1] product status [2] [3] de?nition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). ? koninklijke philips electronics n.v. 2005 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. date of release: 15 august 2005 document number: TDA8777_3 published in the netherlands philips semiconductors TDA8777 triple 10-bit video dac, up to 330 mhz sample frequency 21. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 5 8.1 voltage reference . . . . . . . . . . . . . . . . . . . . . . . 5 8.2 blanking and sync pulse insertion . . . . . . . . . . 6 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 thermal characteristics. . . . . . . . . . . . . . . . . . . 7 11 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 application information. . . . . . . . . . . . . . . . . . 10 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 14 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14.1 introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14.2 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 13 14.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13 14.4 manual soldering . . . . . . . . . . . . . . . . . . . . . . 14 14.5 package related soldering information . . . . . . 14 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 16 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 17 17 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 18 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 19 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 20 contact information . . . . . . . . . . . . . . . . . . . . 17 |
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